Phenolic

Phenolic Insulation consists of rigid phenolic foam boards manufactured with a fibre-free thermoset core and a glass-tissue based facing autohesively bonded during production. Boards are produced to densities suitable for external wall insulation systems and are available in standard dimensions of 1.2m by 0.6m. Thermal conductivity values are declared in accordance with aged performance measurements, with λD figures of 0.022W/(m·K) for 25–44mm thicknesses and 0.021W/(m·K) for 45–100mm thicknesses.

The insulation incorporates a blowing agent with zero Ozone Depletion Potential (ODP) and low Global Warming Potential (GWP). It is used as a component within certain BBA/NSAI Agrément certified external wall insulation systems.

Application

The boards are intended for external wall insulation systems and may be adhesive-fixed and mechanically fixed, or mechanically fixed only, subject to project requirements. Installation sequencing, including fixing pattern and embedment depth, should follow project-specific guidance. The outer faces must align in-plane to form a consistent surface for subsequent basecoat, reinforcement mesh and render layers.

Fire breaks may be required depending on building height and compartmentation requirements. Advice should be sought from the system provider or project specifier where applicable.

Installation Guidance

Boards must be firmly applied against the substrate with tight joints and no gaps. Substrates should be stable, flat, clean and dry. Phenolic boards cannot be rasped to adjust flatness, so substrate preparation or adhesive bedding must accommodate minor localised variations.

Mechanical fixings should be inserted through the boards into the substrate to the minimum embedment specified following pull-out tests. Additional fixings at 300mm centres are required at building corners and all wall apertures. Fixing placement at corners should allow for the insulation thickness plus 75mm from the substrate corner.

L-shaped boards must be installed at all window, door and façade apertures. A staggered bond pattern with interlocking corners is required. Boards smaller than 200mm in height or width should be avoided unless unavoidable due to site geometry, such as between window heads and soffits.

Once installed, boards should be basecoated or otherwise protected to prevent water exposure. Any boards affected by moisture should be removed and replaced before application of render coatings.

Performance Characteristics

• Thermal conductivity (λD):
  0.022W/(m·K) for 25–44mm thicknesses
  0.021W/(m·K) for 45–100mm thicknesses

• Thermal resistance (RD):
  Values range from 1.10 to 4.75(m²·K)/W depending on thickness (25–100mm).

• Reaction to fire:
  Classified as C-s2,d0.

• Thickness tolerance:
  Class T1.

• Dimensional stability:
  DS(70,90) and DS(-20,-).

• Compressive strength:
  CS(Y)100.

• Closed cell content:
  CV.

Where performance data is marked as NPD (No Performance Determined), no claim is made.

Handling, Storage and Limitations

Boards should be stored above ground level in a clean, dry environment and protected from weather before installation. Substrates must be assessed for suitability, and loose or unstable materials removed. Adhesive may be used to level minor irregularities; however, the boards themselves cannot be rasped.

Composition and Certification

Manufacture takes place under management systems certified to ISO 9001:2015, ISO 14001:2015, BS/I.S. OHSAS 18001:2007 and ISO 50001:2011. The insulation forms part of several Agrément-certified rendered external wall insulation systems.

Technical Data